The Model 200 is a benchtop mask aligner that utilizes an air bearing/vacuum chuck leveling system, the substrate is leveled quickly for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The alignment module incorporates micrometers for X, Y, and Z-axis. OAI UV light source(i line-365 nm) provides collimated UV light across the wafer. This tool is capable of making repeatable micron-scale patterns in photoresists using a transmission mask.
Please use the Facility Online Manager for instrument signup.